Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects to production batches involving medium to large substrate areas.
To achieve the desired characteristics in a sputter deposited thin film, the manufacturing process used to fabricate the sputtering target can be critical. Whether the target material comprises only an element, mixture of elements, alloys, or perhaps a compound; the process to produce that defined material in a form suitable for sputtering thin films of consistent quality is as essential as the deposition run parameters perfected by the thin film process engineers and scientists.
Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or bevelled joints. Commonly used targets are circular or rectangular, although other shapes including square and triangular designs can also be produced.
Metal Sputtering Target
Manufacturing processes we use depend on the properties of the target material and its application. Fabrication methods vary from vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed and forged.
Currently our standard round target sizes range from 1" to 20" in diameter, and the rectangular targets are available in lengths up to and over 2000mm in single or multiple piece construction depending on the metal.
Our metal targets are offered in various purity levels to suit your specific requirements, with the minimum purity of 99.5% up to 99.9999% for some metals . Although purity levels higher than required increase material costs, in some instances, the use of too low a purity can result in poor film quality. If you have requirements to specific impurities, we may be able to control them within the target.
In addition to standard configurations we welcome custom design target requests.
Compound Sputtering Target
A wide selection of compounds sputtering targets: oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline and composite mixtures.
Testbourne compound target production methods include vacuum hot pressing, hot isostatic pressing, cold isostatic pressing, and cold press sintering. Depending on the required material targets can be manufactured from 1 inch up to 20 inches in diameter, rectangular targets are available from small to over 1000mm lengths in single or multi sections.
To achieve the best performance and to prevent the target from cracking or over-heating, we strongly recommend bonding any material target to a backing plate.
Rotatable target technology has been used in large area coating manufacturing of architectural glass and flat panel displays.
Rotatable targets have several advantages over planar targets. Rotatable targets normally contain more material and offer a greater utilization in comparison to planar targets. This in turn results in much longer production runs and reduced downtime of the system. The overall benefit is an increase in the throughput of the coating equipment. Secondly, the rotatable targets allow the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with an improved performance during reactive sputtering.
Testbourne Ltd are now supplying cylindrical magnetron sputtering targets which are manufactured in many sizes, ranging from 2" up to 8.625" in diameter, with lengths from a few inches up to 160 inches.
The most commonly used C-MAG rotary targets are available in Chromium, Silver, Aluminium-Silicon, Tin, Titanium Oxide, Stainless steel, Aluminium, Tungsten, Tantalum, Molybdenum, Niobium, Copper and Zinc alloys.
The standard manufacturing methods are plasma spraying onto the base tubes, casting and extrusion of the complete assembly.
Please get in touch to discuss your sputtering target requirements.