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Indium Target Bonding

All Indium based metallic bonded targets include a sputtered metal intermediate bonding layer on the "bonded" side of the target, which acts as a barrier layer protecting the target material integrity from diffusion of the hot primary bonding metal alloy. The metal bonding technology offers excellent thermal and electrical conductivity and is compatible with either DC or RF power supplies. A properly bonded target will stay adhered to the backing plate providing there is a continuous supply of the sufficient cool water and the sputtering source cathode is not powered.

 Metallic bonding can withstand temperatures up to 156 °C.