HomeTechnical Info  »  Application Notes
Technical Info

Application Notes

Sample Preparation Equipment Application Notes


Characterizing Lip Effect on Thin Metal Foils
Evaluating the Precision of Abrasive Slurry Disc Cutting Techniques on GaAs
Characterization of Model 38001
Cutting 8 mm Discs from Hard Disc Drives
Cutting Thin Si Wafers
Lapping and Polishing ZnO Single Crystals to Optical Smoothness
Preparation of Surface Mount Packages Directly on PC Boards for Backside Emission Analysis
Preparation of Hard Disk Drive Magnetic Recording Media for XTEM Analysis
Cross Sectioning Small Hole Arrays
Optimizing Cutting Conditions for Polymeric Materials
Characterizing the Model 660 Low Speed Diamond Saw
Precision Cutting BGA Packages for Ball Bond Integrity Testing
Cutting Highly Different Hardness Materials for Adhesion Analysis
Cutting Glass Optical Ferrules using Two Cutting Methods
Cutting DRAM IC's to Specific Area Prior to FIB Preparation
Low Damage Cross Sectioning of Flip Chip Packages
Precision Cutting of Packaged IC Devices from Printed Circuit Boards
Characterizing the Model 850 Wire Saw
Polishing Protocol for Glass Cover Slides
Lapping and Polishing Glass to Optical Smoothness
Preparing Planar Specimens of Entire PC Board Components
Lapping and Polishing SiC Wafers
Optical Polishing Polystyrene Discs to Specific Dimensions
Using the Model 25010 Oriented Crystal Polisher on Model 920
Evaluation of Solvent Free Removal of Waxes
Preparation of GaN / Sapphire for TEM using Tripod Polishing
Ion Milling Parameters for Various Materials Systems
Plasma Cleaning of Various Specimens for use in TEM
Cutting Rates of Materials on Various Cutting Instruments
Characterizing Low and High Concentration Diamond Wheels for Cutting Materials
Comparing Cutting Times of Selected Diamond Wheel Types
Lapping and Polishing LiNbO3 Crystals at Specific Angles
Cutting Fiber Optic Connectors Using Model 850
Cutting CdTe Detector Discs to Specific Diameter
Cutting AlC Composite for Shaping
Lapping and Polishing Si Die and Wafers
Lapping and Polishing Si Die to Optical Polish Quality
Preparation of Otoliths for Laser Chemical Analysis
Cutting Ti Nb Alloy to Specific Thickness
Cutting Encapsulated Cu Sheet using Model 850 Wire Saw
Cutting Various Composite Materials for Microscopic Investigation
Sample Preparation of Optical Crystals: Cutting and Polishing Methods
Lapping and Polishing Basics
GaN / Sapphire Prepared by the MicroCleave Technique
Lapping and Polishing GaN Fiber Towers for VCSEL Applications
Parallel Laping of Devices for Deprocessing
Evaluation of the Polishing Quality for Edge Polished Silicon
EELS of PLD DLC
Prethinning for FIB TEM Sample Preparation using the Small Angle Cleavage Technique
SACT Preparation of MBE Grown QWIP on GaAs
The Small Angle Cleavage Technique: An Update
Plasma Trimming Applications
Monitoring and Measuring Plate Flatness
Selecting a Diamond Wheel
Improving High Resolution Images using Low Energy Ion Milling
Cutting Steel/Cr Alloy using Various Diamond Wheels
Improving Surface Quality of Petrographic Sections
Comparing Wax Layer Thickness After Mounting
Maintaining Plate Flatness Prior to Lapping and Polishing
Applications of the GentleMill™ to FIB Prepared TEM Specimens
A Method for Pre-FIB Specimen Preparation
Processing YVO4 and Electro-Optic Crystals for Small Scale Fabrication
Lapping and Polishing II-VI Semiconductors
A Method for PVC Specimen Preparation
Producing Smoothly Etched Surfaces using RIE
Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes
Basic Arrangement of Model 910 and 920 for Processing Cross Sections
Kerf Loss Comparisons
Ion Beam Sputtering: Practical Applications to Electron Microscopy
Evaluating Surface Roughness of Ion Beam Sputtered Iridium Using a Large Area Stage
Proper Use of Wire Blades for the Model 850
Improved Sample Mounting for the TL-GM1 GentleMill™
A Simple and Repeatable Zeroing Process for the Model D 500i Dimpler
Accessories for the Model 920 Lapping and Polishing Machine
Setting up and Using Digital Controlled Lapping and Polishing Fixtures
Cu Composite Plate Conditioning for Flatness
Model 93031 Flattness Monitoring Kit
SBT Statolith preparation
KA160 7mm Catalyst Support
Cross Sectional Prep of CEO2 films on NiW
Cross sectional Prep of GaAs devices
Quartz tips cut with 850 wire saw
PVC plastic sample preparation
Precision Dimpling of MgF2 for UV properties
SBT Sardine Otolith Preparation
Precision sectioning of LiF doped crystals
Chemical Thinning Silicon with Model 550

Our company
My account
Contact us
Testbourne Ltd
Unit C, The Loddon Centre
Wade Road
Basingstoke
Hampshire. RG24 8FL, England, UK

+44 (0)1256 467055
+44 (0)1256 362955
Testbourne offers an ISO9001 quality assured service to companies across a wide market area from R&D through to on-line production. Our company objective is to provide a fast, efficient and personalised service, with full technical support to all our customers.
© Testbourne Ltd 2018 Powered by ZOLFIST STUDIO