Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon. Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.
To achieve the desired characteristics in a sputter deposited thin film, the manufacturing process used to fabricate the sputtering target can be critical. Whether the target material comprises only an element, mixture of elements, alloys, or perhaps a compound; the process to produce that defined material in a form suitable for sputtering thin films of consistent quality is as essential as the deposition run parameters perfected by the thin film process engineers and scientists.
Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or beveled joints. Commonly used targets are circular or rectangular, although other shapes including square and triangular designs can also be produced.
An extensive range of metal targets in sizes ranging from 1 inch in diameter to several meters long rectangular plates. Sputter target materials can be generally supplied within the purity range of 99% to 99.9999% but the higher purities are more material dependent. more»
Advancement in alloying techniques has enabled Testbourne to offer a wide range of targets with particular emphasis on specialty custom fabricated alloys. more»
A wide selection of compound based sputtering targets: oxides, nitrides, borides, sulfides, selenides, tellurides, carbides, crystalline and composite mixtures. more»
These 0.1-0.5mm thick targets are mostly made of Titanium Ti, Chromium Cr, Tantalum Ta, Gold Au, Silver Ag, Platinum Pt, Palladium Pd and their alloys.
The targets are designed for laboratory bench coaters and are predominantly 57mm diameter Targets for Agar, Cressington 108/208, Emitech K575/675, ISI 5400, JEOL JFC 1200/1300, PELCO Model 3, SC4/SC5/SC6/SC7, Polaron 5000/5400/SC7610/SC7620, Quorum E5000 / E5400 / E5200 / SC7610 / SC502 / SC7620 and SPI Module/Super sputter coaters.
54mm diameter Targets for Bal-Tec SCD005/050 and MED10/20 Sputter Coaters.
And smaller diameter targets 19mm, 25.4mm and other standard diameters. more»
Testbourne Ltd is proud to announce its new range of rotatable sputtering targets. The rotatable targets are produced by either plasma spraying onto a base tube or from solid pieces. Lengths of over 1000 mm are manufactured. more»
As a complimentary service to your process Testbourne Ltd provide high quality and competitive Target Bonding to Backing Plates. We can supply backing plates to your specifications whether it is a plain round or rectangular shape plate or a specialized OEM platform design. In many instances, backing plates can be retrieved from spent sputtering target backing plate assemblies. The recovered backing plate is then inspected to ensure it is within specification, cleaned and re-bonded to a new sputtering target.
We also have Silver Epoxy Bonding Kits available in 50g and 100g size packs.
Nowadays applications of sputtering range from semiconductor industry for Thin Film deposition of various materials in integrated circuit processing, to architectural window glass for energy conservation, decorative with familiar gold-coloured hard coating created by Titanium Nitride and hardwearing coatings for tools and consumer goods, to deposition of metals during fabrication of CDs and DVDs . All of the materials listed below are available from Testbourne Ltd in Sputtering Target form.
Flat Panel Displays
Aluminium Al, Aluminium-Titanium Al-Ti, Chromium Cr, Chromium-Molybdenum Cr-Mo, Copper Cu, Copper alloy, Indium Tin oxide (ITO), Silver Ag, Tungsten W, Molybdenum Mo, Molybdenum-Tungsten Mo-W, Molybdenum-Niobium Mo-Nb, Tantalum Ta, Silicon Si.
STN, TN, TFT, FED, PDP, OLED & CF
ITO target with density of 99% min
Cr & SiO2 targets in single sections up to 1.4mtrs
Aluminium Al, Aluminium-Titanium Al-Ti, Copper Cu, Gold Au, Silver Ag, Silicon Si, Zinc sulphide ZnS, Terbium-Iron-Cobalt Tb-Fe-Co and many other alloys.
CD/DVD-R, CD/DVD-ROM, CD/DVD-RW & MO
Automotive & Architectural Glass, WEB Coating
Chromium Cr, Titanium Ti, Tin Sn, Zinc Zn, Silver Ag, Silicon Si, Silicon-Aluminium Si-Al, Nickel-Chromium Ni-Cr, Zinc-Aluminium Zn-Al, Titanium oxide TiOx
Applications requiring coatings with gold, silver, black and rainbow colour affects.
Applications: Cutting tools requiring hard wearing surfaces, corrosion resistance and reduced friction.
Chromium Cr, Titanium Ti, Titanium-Aluminium Ti-Al, Zirconium Zr, Nickel Ni, Tungsten W, Silicon Si, Silicon dioxide SiO2, Aluminium oxide Al2O3, nitrides, borides and other ceramics.
Applications: CIG(S), Silicon or Cadmium Telluride CdTe based technology.
Cadmium Telluride CdTe, Cadmium Selenide CdSe, Cadmium Sulphide CdS, Indium-Tin Oxide In2O3-SnO2, Silicon dioxide SiO2, Zirconium boride ZrB2, various metals and their alloys
Thin Film filters for DWDM's
Tantalum pentoxide Ta2O5, Silicon dioxide SiO2, Tantalum Ta, Niobium Nb, Titanium Ti, Chromium Cr, Nickel Ni, Gold-Silver Au-Ag.
Magnetic Data Storage Devices
Chromium Cr, Chromium-Molybdenum Cr-Mo, Chromium-Tungsten Cr-W, Chromium-Vanadium Cr-V, Chromium-Molybdenum-Tantalum Cr-Mo-Ta, Chromium-Titanium Cr-Ti, Ruthenium Ru, Ruthenium-Alumnium Ru-Al, Cobalt-Chromium-Tantalum-Boron, Titanium Ti, Titanium-Aluminium Ti-Al, Nickel alloys, Iron-Cobalt-Boron Fe-Co-B, Iron-Tantalum-Carbon Fe-Ta-C
Tantalum Ta, Ruthenium Ru, Cobalt-Iron-Boron Co-Fe-B, Tungsten-Silicon W-Si, Molybdenum-Silicon Mo-Si, Tantalum-Silicon TaSi, Titanium-Tungsten Ti-W, Tungsten W.
Typical Materials: Gold Au, Gold-Palladium Au-Pd, Gold-Platinum Au-Pt, Gold-Silver Au-Ag, Platinum Pt, Platinum-Palladium Pt-Pd, Platinum-Silver Pl-Ag, Silver Ag, Chromium Cr, Iron Fe, Cobalt Co, Molybdenum Mo, Carbon C