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SBT Sample Preparation Equipment

Electron Microscopy

South Bay Technology offers a complete solution for TEM specimen preparation. SBT offers systems for each stage of the preparation process from bulk material processing to low energy ion milling and plasma cleaning. SBT also offers the most advanced systems for ion beam sputter deposition and etching which produces ultra-thin, uniform and fine grain metal and carbon films on specimens for FESEM and TEM applications.


Disc Punch
Model 310

Disc Punch

For punching out 3mm discs from thin metal sheets for TEM without mechanical distortion.
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Rotary Disc Cutter
Model 360

Rotary Disc Cutter

For cutting 3mm discs for TEM and larger discs up to 50mm in diameter using a gentle rotary action with an abrasive slurry or diamond-tipped tool.
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Ultrasonic Cutter
Model 380

Ultrasonic Cutter

Utilizes abrasive powders and high speed, vibratory motion to cut discs, holes, cylinders, squares and other shapes from hard, brittle materials.
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BiPod Polisher™
Model 595

BiPod Polisher™

A compact specimen preparation tool for mechanical polishing of SEM and TEM cross sections.
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Tripod Polisher®
Model 590

Tripod Polisher®

For preparing samples for both SEM and TEM analysis, in both plan-view and cross section view utilizing mechanical polishing techniques.
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Precision Dimpling Instrument
Model 515

Precision Dimpling Instrument

For pre-thinning TEM specimens either prior to ion milling or prior to a quick etch on the Model 550D Single Vertical-Jet ElectroPolisher.
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Dimpler®
Model D500I

Dimpler®

Utilizes a breakthrough in electronic and mechanical integration which continuously monitors and controls dimpling parameters and accurately terminates at a preset specimen thickness.
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Plasma Cleaner
Model PC2000

Plasma Cleaner

For simultaneous cleaning of a specimen and a specimen stage which minimizes hydrocarbon contamination of specimens analyzed via SEM, TEM, STEM and/or AEM.
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Ion Beam Sputter Deposition and Etching System
Model IBS/e

Ion Beam Sputter Deposition and Etching System

Improves high resolution electron microscopy imaging by depositing ultra-thin, fine grain metal and carbon films on specimens.
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Single Vertical Jet Electropolisher
Model 550D

Single Vertical Jet Electropolisher

For dislocation free thinning of metals, semiconductors, superconductors, glass and ceramics for TEM analysis using either electrolytic or chemical action.
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MicroCleave™Kit
Model 520

MicroCleave™Kit

A simple and inexpensive method of producing superior cross sectional TEM specimens from Si, Ge, lll-V, ll-VI semiconductors, glass, sapphire, MgO, and other brittle materials.
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Lapping & Polishing

South Bay Technology has developed fully integrated lapping and polishing systems for the processing of Si, LiNbO3, SrTiO3, TiO2, InP, GaAs, SiC, Sapphire and similar materials. Systems are suitable for flat and parallel lapping of wafers, edge polishing of wave guides and angle polishing of crystals to precise tolerances with a scratch free surface finish.


Electrolytic Crystal Polisher
Model 451

Electrolytic Crystal Polisher

For damage free machining of materials by electrolytic or chemical action to produce flat, polished and precisely oriented surfaces.
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Automatic Electrolytic Crystal Polisher
Model 460

Automatic Electrolytic Crystal Polisher

Similar to the Model 451, but with an automatic feed feature.
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Grinder/Polisher
Model 900CE

Grinder/Polisher

An 8" (200mm)wheel for low volume metallographic polishing.
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Lapping and Polishing MaChine 910
Model 910

Lapping and Polishing MaChine 910

A multi-purpose 8" (200mm) instrument designed for precision lapping and polishing as well as standard metallurgical grinding.
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Lapping and Polishing Machine 920
Model 920

Lapping and Polishing Machine 920

A multi-purpose 8" (200mm) instrument used for accurately lapping and polishing materials utilizing integrated workstations and precision lapping and polishing fixtures.
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Cutting & Sectioning

South Bay Technology has developed a series of precision saws to meet the extremely diverse requirements in a wide range of materials processing applications. System capabilities range from high precision slicing of extremely brittle materials to the less stringent application of metallographic sectioning. Systems also offer the ability to precisely cut oriented single crystals using wire blades, diamond wheels or acid etching.


Low Speed Diamond Wheel Saw 650
Model 650

Low Speed Diamond Wheel Saw 650

A compact, multipurpose, precision saw designed to cut a wide variety of materials up to 1.3" (33mm) in diameter with minimal subsurface damage.
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Low Speed Diamond Wheel Saw 660
Model 660

Low Speed Diamond Wheel Saw 660

A multipurpose precision saw using diamond wheels up to 7" (178mm) in diameter for cutting a wide variety of materials up to 2.8" (71mm) in diameter with minimal subsurface damage
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Acid Saw
Model 750

Acid Saw

For damage free cutting of materials using acid or solvent which is compatible with its PVC and stainless steel construction.
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Wire Saw 810
Model 810

Wire Saw 810

The most gentle mechanical method for cutting virtually any material using either a diamond impregnated wire blade or a plain wire blade with an abrasive slurry. The Model 810 incorporates a simple, low volume abrasive recirculating system and can be used to accurately cut oriented crystals.
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Wire Saw 850
Model 850

Wire Saw 850

The most gentle mechanical method for cutting virtually any material using either a diamond impregnated wire blade or a plain wire blade with an abrasive slurry. The Model 850 can be used to cut oriented crystals and is also capable of precision alignment with the optional alignment microscope.
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Diamond Band Saw
Model 865

Diamond Band Saw

For medium precision, efficient cutting of virtually any material, including hard steels, soft polymers, and brittle materials.
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Microelectronic Processing


Backside Emission Analysis Preparation System (BEAPS)
Model 575

Backside Emission Analysis Preparation System (BEAPS)

For backside thinning packaged die to less than 50 microns while maintaining package integrity.
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Plasma Etcher
Model PE2000

Plasma Etcher

For isotropic reactive gas plasma etching, cleaning and surface treatment.
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Reactive Ion Etcher
Model RIE2000

Reactive Ion Etcher

For anisotropic reactive gas etching of microelectronic devices, deprocessing and failure analysis applications.
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Crystal Orientation

South Bay Technology Crystal Orientation tools are unique in their ability to interface with SBT cutting and polishing systems. A crystal can be oriented on an x-ray track, transferred to a cutting instrument and subsequently transferred to a lapping and polishing system all while maintaining crystal orientation.


Multi-Axis Lapping Fixture
Model 170

Multi-Axis Lapping Fixture

Integrated orientation, lapping and polishing within 0.1°.
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Optical Orientation Instrument
Model 210

Optical Orientation Instrument

Reflected laser beam orientation from cleaved or preferentially etched crystal surfaces.
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2-Axis Goniometer
Model 250

2-Axis Goniometer

For use with orientation, cutting and polishing systems.
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Oriented Crystal Lapping Fixture
Model 25010

Oriented Crystal Lapping Fixture

For integrated orientation, cutting and polishing using the Model 250 Goniometer.
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3-Axis Goniometer 260
Model 260

3-Axis Goniometer 260

For orientation prior to cutting on the Model 850 Wire Saw or Model 660 Diamond Wheel Saw.
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3-Axis Goniometer 265
Model 265

3-Axis Goniometer 265

The Model 265 is a larger version of the Model 260 and is mounted on a 7" square flat base which can be adapted for a wide range of applications.
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Accessories

South Bay Technology has carefully selected and qualified products that meet the stringent needs of materials analysts. This comprehensive, unique and competitively priced range of consumables for electron microscopy and metallography provides the assurance that the customer is receiving only the highest quality products.


Pressure Pot
Model 930

Pressure Pot

Used in conjunction with acrylic and epoxy cold mounting materials to produce clearer, denser, and less porous mounts.
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FIB Fortress™ Holder
Model FIB

FIB Fortress™ Holder

Fortress™ FIB Holders are reusable holders that secure FIB samples that are held in a specific orientation without the use of adhesives, adhesive pads, or conductive paint.
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Sample Saver™ Storage Container SS100
Model SS100

Sample Saver™ Storage Container SS100

The SampleSaver™ Portable Storage Container system is a specialized container that enables a user to replace the reactive atmospheric air typically present in the container with an inert gas species.
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Sample Saver™ Storage Container
Model SS200

Sample Saver™ Storage Container

The SampleSaver™ Portable Storage Container system is a specialized container that enables a user to replace the reactive atmospheric air typically present in the container with an inert gas species.
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Lapping Fixtures


Shim Controlled Lapping Fixtures
Model SLP1

Shim Controlled Lapping Fixtures

The shim controlled lapping and polishing fixtures are designed to lap or polish samples to the same thickness over and over again using shims to control the final thickness.
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Lapping Fixtures
Model MLP1

Lapping Fixtures

South Bay Technology has developed a large number of lapping and polishing fixtures that hold samples from less than 1/8" to over 8" in diameter.
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Special Lapping Fixtures
Model MLP2

Special Lapping Fixtures

The South Bay Technology Precision Lapping and Polishing Fixtures are designed to accurately produce polished parallel, tapered or critically oriented samples with minimal sub-surface damage. A series of specialized fixtures has been developed for lapping
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VersaLap™ Fixtures
Model VLP1

VersaLap™ Fixtures

In most materials preparation laboratories, lapping and polishing of materials is necessary for both process control and specimen analysis.
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Unit 2, Hatch Industrial Park Greywell Road, Hatch Basingstoke Hampshire, RG24 7NG, England, UK.
High Purity Materials For Research, Development and Industry © 2014 Testbourne Limited
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