ULTRA-FAST, HIGH POWER ANALYSIS OF MICRO-ARCING Reducing Wafer Loss and Improving Yields
The INFICON Sion™ RF Detector provides real-time, high-power analyses of plasma micro-arcing which can cause damage to the target, the film being deposited, and even the wafer surface in chemical vapor deposition (CVD) and ETCH processes. More compact than any other device on the market, Sion employs the INFICON FabGuard® Integration and Analysis System to detect arcs that were previously undetectable. The result is reduced wafer loss, improved yields - and increased profitability.
Features at a Glance
Small Easy Clamp-on Sensor Equals Huge Advantage
Sion's performance isn't hampered as are inline cable mount sensors; it doesn't change the tool's RF delivery system characteristics. The innovative clamp-on design is an extremely compact, non-intrusive detector which connects directly to the process chamber's high-power RF delivery system to collect voltage and current information at speeds up to 20 KHz. This includes a high-speed signal converter connecting directly to the FabGuard data collection and analysis system. Other devices cannot compete with the performance of the Sion RF Detector, because large RF detectors must be squeezed into locations which allow only inadequate arc detection.
FDC arc detection for CVD, ETCH and PVD applications.
ASSOCIATED TECHNICAL INFORMATION
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